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market@legion.com.cn
Excellent flexibility, mechanical properties, chemical resistance, heat resistance Ultra low water absorption and water vapor permeability Excellent dimensional stability and processability Dk / DF has high stability at different frequencies / temperatures Thermoplastic resin system, direct hot-melt composite, has good PCB processing performance, suitable for flexible multi-layer board design Excellent cost performance
High frequency single side LCP-FCCL
It includes two product series: low melting point lgs-m series and high melting point lgs-h series.
| LGS-M | LGS-H | ||||||||
| LM-02512 | LM-05012 | LM-07512 | LM-10012 | LH-02512 | LH-05012 | LH-07512 | LH-10012 | ||
| Dielectric layer | Material | LCP-M | LCP-H | ||||||
| Thickness | 25µm | 50µm | 75µm | 100µm | 25µm | 50µm | 75µm | 100µm | |
| Copper foil | Material | RA | RA | ||||||
| Thickness | 12µm | 12µm | |||||||
| Remarks | Roll width: 250mm; 520mm; thickness and type of copper foil can be customized according to customer requirements. | ||||||||
Excellent flexibility, mechanical properties, chemical resistance, heat resistance;
Ultra low water absorption and water vapor permeability;
Excellent dimensional stability and processability;
Dk / DF has high stability at different frequencies / temperatures;
Thermoplastic resin system, direct hot-melt composite, has good PCB processing performance, suitable for flexible multi-layer board design;
Excellent cost performance.
| Items | LGS-M | LGS-H | Test method |
| melting temperatuew (Tm) ℃ | 280~300 | 330~350 | DSC |
| flame retardency | VTM-0 | VTM-0 | UL 94 |
| tensile strength MPa | >230 | >240 | IPC-TM-650, 2.4.19 |
| elongation % | >40 | >30 | IPC-TM-650, 2.4.19 |
| peel strength N/mm | 1.4 | 1.5 | IPC-TM-650 2.4.8 |
| CTE (X/Y/Z) ppm/℃ | 16/16/17 | 17/16/17 | IPC-TM-650 2.4.24 |
| surface resistance Ω | >1015 | >1015 | IPC-TM-650, 2.5.17.1 |
| volume resistivity Ω.cm | >1015 | >1015 | IPC-TM-650, 2.5.17.1 |
| water absorption % | 0.007 | 0.007 | IPC-TM-650, 2.5.6.2 |
| delectic constant /Dk | 2.8~3.0 | 2.8~3.0 | IPC-TM-650-2.5.5.5 |
| dielectric loss factor/Df | 0.002~0.003 | 0.002~0.003 | IPC-TM-650-2.5.5.5 |
| thermal conductivity W/(m.k) | 0.28-0.30 | 0.28-0.30 | ASTM-D5470 |
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