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market@legion.com.cn
The material has uniform properties, stable electrical properties and small fluctuation High heat resistance of welding Compared with PI film, it has lower dielectric constant and dielectric loss factor Compared with PI membrane, it has lower water absorption and water vapor permeability It has stable electrical properties and good dimensional stability in high humidity environment It can be directly hot pressed with copper foil and other materials, easy to drill and bend, and has excellent processability
Category
LCP film for high frequency flexible copper clad laminate
Two series: low melting point lgl-m series and high melting point lgl-h series
Model
| LGL-M | LGL-H | |||||||
| Grade | LM-25 | LM-50 | LM-75 | LM-100 | LH-25 | LH-50 | LH-75 | LH-100 |
| Thickness | 25µm | 50µm | 75µm | 100µm | 25µm | 50µm | 75µm | 100µm |
| Width | 530mm | 530mm | ||||||
Features
The material has uniform properties, stable electrical properties and small fluctuation
High heat resistance of welding
Compared with PI film, it has lower dielectric constant and dielectric loss factor
Compared with PI membrane, it has lower water absorption and water vapor permeability
It has stable electrical properties and good dimensional stability in high humidity environment
It can be directly hot pressed with copper foil and other materials. It is easy to drill and bend, and has excellent processability
Application
5G high frequency high speed flexible copper clad laminate
Physicochemical properties
| items | LGD-M | LGD-H | Test method |
| 熔点 (Tm) ℃ | 280~300 | 330~350 | DSC |
| 耐燃性 | VTM-0 | VTM-0 | UL 94 |
| 抗拉强度 MPa | >180 | >190 | Legion Method |
| 延伸率 % | >40 | >30 | Legion Method |
| 拉伸模量 MPa | 3500-3700 | 3000-3200 | Legion Method |
| 吸湿率 % | 0.03 | 0.03 | Legion Method23℃，50%R.H |
| 表面电阻 Ω | >4×1016 | >5×1016 | IEC62631-3-1/2 |
| 体积电阻 Ω.cm | >3×1016 | >2×1016 | IEC62631-3-1/2 |
| 击穿电压 kV/mm | 200 | 200 | IEC60243-1 |
| 介电常数/Dk | 2.8~3.0 | 2.8~3.0 | Fabry-Perot method(25℃,28GHz, XY 方向) |
| 介电损耗因子/Df | 0.002~0.003 | 0.002~0.003 | Fabry-Perot method(25℃,28GHz, XY 方向) |
| 热膨胀系数/(CTE) ppm/℃ | 18 | 16 | TMA |