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market@legion.com.cn
Excellent flexibility, mechanical properties, chemical resistance, heat resistance
Ultra low water absorption and water vapor permeability
Excellent dimensional stability and processability
Dk / DF has high stability at different frequencies / temperatures
Thermoplastic resin system, direct hot-melt composite, has good PCB processing performance, suitable for flexible multi-layer board design
Excellent cost performance
Category
High frequency double sided LCO-FCCL
It includes two product series: low melting point lgd-m series and high melting point lgd-h series.
Model
| LGD-M | LGD-H | ||||||||
| LM-02512 | LM-05012 | LM-07512 | LM-10012 | LH-02512 | LH-05012 | LH-07512 | LH-10012 | ||
| Dielectric layer | Material | LCP-M | LCP-H | ||||||
| Thickness | 25µm | 50µm | 75µm | 100µm | 25µm | 50µm | 75µm | 100µm | |
| Copper foil | Material | RA | RA | ||||||
| Thickness | 12µm | 12µm | |||||||
| Remarks | Roll width: 250mm; 520mm; thickness and type of copper foil can be customized according to customer requirements. | ||||||||
Features
Excellent flexibility, mechanical properties, chemical resistance, heat resistance;
Ultra low water absorption and water vapor permeability;
Excellent dimensional stability and processability;
Dk / DF has high stability at different frequencies / temperatures;
Thermoplastic resin system, direct hot-melt composite, has good PCB processing performance, suitable for flexible multi-layer board design;
Excellent cost performance.
hysicochemical properties
| Items | LGD-M | LGD-H | Test method |
| melting temperature (Tm) ℃ | 280~300 | 330~350 | DSC |
| flame retardancy | VTM-0 | VTM-0 | UL 94 |
| tensile strength (MPa) | >230 | >240 | IPC-TM-650, 2.4.19 |
| elongation (%) | >40 | >30 | IPC-TM-650, 2.4.19 |
| peel strength (N/mm) | 1.4 | 1.5 | IPC-TM-650 2.4.8 |
| CTE (X/Y/Z) (ppm/℃) | 16/16/17 | 17/16/17 | IPC-TM-650 2.4.24 |
| surface resistance (Ω) | >1014 | >1014 | IPC-TM-650, 2.5.17.1 |
| volume resistivity (Ω.cm) | >1014 | >1014 | IPC-TM-650, 2.5.17.1 |
| water absorption (%) | 0.007 | 0.007 | IPC-TM-650, 2.5.6.2 |
| dielectric constant / Dk | 2.8~3.0 | 2.8~3.0 | IPC-TM-650-2.5.5.5 |
| dielectric loss factor / Df | 0.002~0.003 | 0.002~0.003 | IPC-TM-650-2.5.5.5 |
| thermal conductivity W/(m.k) | 0.28-0.30 | 0.28-0.30 | ASTM-D5470 |
Application
5G base station antenna and power amplifier;
5G mobile phone;
Automatic driving vehicle millimeter wave radar;
Large scale phased array antenna;
Telemedicine.
