Printed circuit board is known as "the mother of electronic system products", which directly determines the quality and competitiveness of electronic products. Copper clad laminate is the most important raw material in printed circuit board. With the advent of 5G era, the traditional epoxy based copper clad laminate and PI based copper clad laminate can not meet the transmission performance requirements of 5G with high frequency, high speed, super large capacity and ultra-low delay, which brings historic opportunities to the development of high-frequency copper clad laminates. LCP based copper clad laminates are considered to be the best key supporting materials in 5G commercial era due to its unique comprehensive performance advantages
Challenges for Chinese industry
Challenge 1: There is a big gap between Chinese companies and US or Japanese companies in the field of LCP resin development. And it’s difficult to narrow this gap in the near future;
Challenge 2: Because of the characteristics of LCP resin, it is very difficult to produce LCP film and LCP-FCCL;
Challenge 3: The equipment for LCP film making, post-processing and LCP based copper clad laminate is very difficult and mainly relies on imports;
Challenge 4: The accuracy of hot pressing machine for LCP film and copper foil composite is difficult to meet
1. Legion has mastered the integration technology of LCP film production, which can provide LCP film total solutions and products that meet 5G communication requirements;
2. LCP based copper clad laminate production line developed independently is available;
The most important of LCP-FCCL laminating equipment is the accuracy of hot pressing roller, including the temperature control accuracy and machining accuracy. The temperature control accuracy of the hot pressing roller produced by Shanghai Legion can reach 450℃±1℃, which is in the absolute leading level in China.In addition, the mechanical precision control of hot pressing composite roller is also very important. In order to avoid the influence of thermal deformation, it is necessary to design a reasonable physical structure, correct material selection, reasonable material heat treatment, and supplemented by a specially developed processing technology to produce the counter pressing composite roller which meets the high precision requirements.
LCP film is a thermoplastic resin, which can be directly laminated with copper foil at high temperature without precoating on the surface of the film. Therefore, compared with PI film and copper foil, the composite process is more concise, environmental-friendly and efficient.
In order to prevent the oxidation of copper foil under high temperature, it is necessary to protect the copper foil by adding protective film as shown in the process flow chart, or by filling nitrogen in the composite process section.
Main process parameters of production line
Linear speed: 2 ~ 10m / min
Copper foil thickness: 8 ~ 35μm
LCP film thickness: 20 ~ 120μm
PI protective film thickness: 20 ~ 80μm
Pressure range of hot pressing roller: 20 ~ 200kN
LCP-FCCL thickness: 40 ~ 160μm
Thickness deviation: ± 1 ~ 2%